TGU3A-M01-GM
Intel® Tiger Lake-UP3 /TGL-H35 Processor Support high performance gigabit LAN TPM Security IC optional 1×DDR4 SO-DIMM,up to 32GB HDMI/VGA Support dual-screen synchronous/asynchronous display 1×M.2 Expansion slot,Expandable WIFI and Bluetooth All aluminum alloy chassis, with good rust-proof, corrosion-proof, heat dissipation performance Support watchdog, Wake up on LAN, PXE diskless boot, Wake up by RTC Applicable to retail, automatic control, enterprise office and other applications
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- 商品名稱: TGU3A-M01-GM
- 産品定位: 工業盒子
- 應用: 工業控制
- 行業類整機: 工業盒子
- 列表數據: 工業盒子 1×DDR4 SO-DIMM,Single Channel,up to 16GB Windows10/11,Linux 205(W)×105(D)×63.5mm(H)
Intel® Tiger Lake-UP3 /TGL-H35 Processor Support high performance gigabit LAN TPM Security IC optional 1×DDR4 SO-DIMM,up to 32GB HDMI/VGA Support dual-screen synchronous/asynchronous display 1×M.2 Expansion slot,Expandable WIFI and Bluetooth All aluminum alloy chassis, with good rust-proof, corrosion-proof, heat dissipation performance Support watchdog, Wake up on LAN, PXE diskless boot, Wake up by RTC Applicable to retail, automatic control, enterprise office and other applications
ProcessorIntel® Tiger Lake UP3 Corei3/i5/i7
Memory1×DDR4 SO-DIMM,Single Channel,up to 16GB
GraphicsIntel® UHD Graphics
1xDP,Up to 4096*2160@60Hz
1xHDMI,Up to 4096*2160@60Hz
Storage1xM.2,M Key,2242/2280 ( SATA 3.0) 1xSATA
Expansion1xM.2,E Key,2230 WIFI&BT
1xM.2,B Key,3042 4G/5G
Rear Panel1×DC_IN,12V/19 DC_IN
1xHDMI+DP
2×RJ45,Support 10/100/1000/2500Mbps
3xUSB3.2 Gen1,1xUSB2.0
4xCOM
Front Panel2*USB2.0
1xSIM
OSWindows10/11,Linux
Dimension164.8(W)×105(D)×82.5(H)mm
Weight1.11kg
MaterialAlu alloy
Surface treatmentAnode black
Wall hangingSupport
EnvironmentOperating : Temperature:-10~50℃ Humidity:5%~90% Non-condensing
Storage:Temperature:-40~85℃ Humidity:5%~90%,Non-condensing
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